By Gordon Roberts, Friedrich Taenzler, Mark Burns
With the proliferation of advanced semiconductor units containing electronic, analog, mixed-signal, and radio-frequency circuits, brand new engineer has to be fluent in all 4 circuit kinds. Written for complex undergraduate and graduate-level scholars, in addition to engineering pros, An Introduction to Mixed-Signal IC try and Measurement, moment variation, encompasses analog, mixed-signal and radio-frequency circuits exams, with many correct commercial examples. The textual content assumes an outstanding history in analog and electronic circuits and a operating wisdom of desktops and desktop programming.
An creation to Mixed-Signal IC attempt and Measurement, moment version, contains examples and illustrations--featuring cutting-edge business technology--to enhance and liven up the textual content. The booklet additionally introduces large-scale mixed-signal circuit and person circuit assessments, discusses the value-added advantages of mixed-signal IC checking out to a manufacturer's product, and obviously defines the position of the attempt engineer.
New to This Edition
* a brand new bankruptcy on RF try out tools and basics of RF Testing
* a brand new bankruptcy on Clock and Serial info Communications Channel Measurements
* assurance of RF load board design
* New insurance of probabilistic reasoning for mixed-signal trying out
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Additional info for An Introduction to Mixed-Signal IC Test and Measurement
Assuming that all components in the meter are perfectly linear (with the exception of the meter’s quantization error), compare the accuracy achieved using two simple DC measurements with the accuracy achieved using the sample-anddifference circuit. Solution: The simplest way to measure offset using a single-ended DC voltmeter is to connect the meter to the OUTP output, measure its voltage, connect the meter to the OUTN output, measure its voltage, and subtract the second voltage from the ﬁrst. 35 V DUT output signals.
Characterization testing can be quite time consuming due to the large number of tests involved. Extensive characterization is therefore economically unacceptable in high-volume production testing of mixed-signal devices. Once worst-case test conditions have been established and the design engineers are confident that their circuits meet the required specifications, a more streamlined production test program is needed. The production test program is created from a subset of the characterization tests.
Instrument relay matrix. DIB connections Voltmeter + Voltmeter – DC source 1 DC source 2 DC source 3 DC source 4 D i g i t i ze r 1 Etc… Chapter 2 • Tester Hardware the DIB board. The exact architecture of relays, matrices, and signal paths varies widely from one ATE vendor’s tester to the next. 6 Relay Control Lines Despite the high degree of interconnection flexibility provided by the general-purpose relay matrix and other instrument interconnect hardware, there are always cases where a local DIB relay (placed near the DUT) is imperative.