Download An Introduction to Mixed-Signal Test and Measurement by Gordon Roberts, Friedrich Taenzler, Mark Burns PDF

By Gordon Roberts, Friedrich Taenzler, Mark Burns

Built-in circuits incorporating either electronic and analog features became more and more conventional within the semiconductor undefined. Mixed-signal IC attempt and size has grown right into a hugely really expert box of electric engineering. even if, try out engineering continues to be a comparatively unknown occupation in comparison to IC layout engineering.

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Extra info for An Introduction to Mixed-Signal Test and Measurement

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When characterizing a small number of DUTs at a variety of temperatures, a less expensive and cumbersome method of temperature control is needed. 19. Temptronicsforced-temperature system. 19). The nozzle of a forcedtemperaturesystem can be seatedagainstthe Dill board or bench characterizationboard, fornling a small thernlal chamberfor the DUT. Many forced-temperature systemsare able to raiseor lower the DUT's ambienttemperature acrossthe full military range(-55 to + 125°C). 1 Concurrent Engineering On a poorly managedproject, the test engineer might not see the specifications for a device to be tested until after the first prototype devices arrive.

Continuous process improvements and better photolithography allow the design engineersto add more functions on a single semiconductor chip at little or no additional cost. Unfortunately, test time (especially data collection time) cannot be similarly reduced by simple photolithography. A 100-Hz sine wave takes 10 ms per cycle no matter how small we shrink a transistor. The only hope of salvation from photolithography is the addition of test features into the design itself that aid in the testing of the DUT.

The pinout and package infonnation is much more relevant to test engineering. The test engineer refers to the pinout and packageinfonnation to design the DIB for each packagetype. The device description gives a quick overview of the device's functionality. 2), the device description defines the various operations of the device in detail. The test program must guaranteeall these functions, though not necessarily in a straightforward manner. For instance, the device description may depict a circuit that divides an externally generated I-MHz reference clock by one million, producing a l-s timebase.

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